Rohde & Schwarz and Samsung first to verify LTE Advanced uplink carrier aggregation
Munich, Nov 19, 2013 - In a joint effort, Rohde & Schwarz and Samsung have successfully tested and verified the Release 10 feature – uplink carrier aggregation. They used a Samsung internal test device with a Samsung SHANNON300 modem chipset as DUT and tested it with an LTE-Advanced-ready R&S CMW500 wideband radio communication tester.
Rohde & Schwarz and Samsung reached a significant milestone in the commercial implementation of LTE-Advanced by successfully verifying uplink carrier aggregation in the real form factor. The tested Samsung DUT, a 6.3 inch real form factor test device, supports two transmissions with a single SHANNON300 baseband chipset, making the SHANNON300 the world’s first LTE-Advanced ASIC chipset to verify uplink carrier aggregation. Commercial devices with two transmission antennas are currently still a challenge. In the future, uplink carrier aggregation and uplink MIMO will be required for the demanding uplink throughput of wireless Internet services such as multi-media upload to cloud servers.
R&S CMW-KP597 for Release 10 uplink carrier aggregation is now available for the
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